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JEDEC

Showing 31–45 of 419 results

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GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS
Published by Publication Date Number of Pages
JEDEC 05/01/1996 8
JEDEC JEP126
Original price was: $48.00.Current price is: $28.80.
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GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING
Published by Publication Date Number of Pages
JEDEC 11/01/1996 10
JEDEC JEP128
Original price was: $51.00.Current price is: $30.60.
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GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING (TUBES, TRAYS, AND TAPE AND REEL)
Published by Publication Date Number of Pages
JEDEC 11/01/2016 14
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JEDEC JEP130B
Original price was: $54.00.Current price is: $32.40.
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Potential Failure Mode and Effects Analysis (FMEA)
Published by Publication Date Number of Pages
JEDEC 08/01/2018 28
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JEDEC JEP131C
Original price was: $72.00.Current price is: $43.20.
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PROCESS CHARACTERIZATION GUIDELINE
Published by Publication Date Number of Pages
JEDEC 08/01/2018 40
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JEDEC JEP132A
Original price was: $78.00.Current price is: $46.80.
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GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS
Published by Publication Date Number of Pages
JEDEC 01/01/2010 37
JEDEC JEP133C
Original price was: $78.00.Current price is: $46.80.
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GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS
Published by Publication Date Number of Pages
JEDEC 09/01/1998 15
JEDEC JEP134
Original price was: $56.00.Current price is: $33.60.
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SIGNATURE ANALYSIS
Published by Publication Date Number of Pages
JEDEC 07/01/1999 18
JEDEC JEP136
Original price was: $59.00.Current price is: $35.40.
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COMMON FLASH INTERFACE (CFI) IDENTIFICATION CODES
Published by Publication Date Number of Pages
JEDEC 05/01/2004 12
JEDEC JEP137B
Original price was: $53.00.Current price is: $31.80.
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USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE
Published by Publication Date Number of Pages
JEDEC 09/01/1999 11
JEDEC JEP138
Original price was: $53.00.Current price is: $31.80.
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GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
Published by Publication Date Number of Pages
JEDEC 12/01/2000 18
JEDEC JEP139
Original price was: $59.00.Current price is: $35.40.
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BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
Published by Publication Date Number of Pages
JEDEC 06/01/2002 13
JEDEC JEP140 (R2006)
Original price was: $54.00.Current price is: $32.40.
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GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID / MCM PRODUCTS
Published by Publication Date Number of Pages
JEDEC 05/01/2002 29
JEDEC JEP142 (R2009)
Original price was: $72.00.Current price is: $43.20.
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SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES
Published by Publication Date Number of Pages
JEDEC 01/01/2019 37
JEDEC JEP143D
Original price was: $76.00.Current price is: $45.60.
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GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
Published by Publication Date Number of Pages
JEDEC 11/01/2011 36
JEDEC JEP144A
Original price was: $57.00.Current price is: $34.20.
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