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GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING
Published by | Publication Date | Number of Pages |
JEDEC | 11/01/1996 | 10 |
JEDEC JEP128 – GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING
This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests that require wafer-probe card to make electrical contact to test structures. Widespread use of this guide will afford the efficient and cost-effective use of water-probe test stations because of the need for fewer probe cards and probe-card changes to accommodate the various test structures that may need to be tested.
Product Details
- Published:
- 11/01/1996
- Number of Pages:
- 10
- File Size:
- 1 file , 190 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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