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IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
Published by | Publication Date | Number of Pages |
JEDEC | 03/01/2009 | 46 |
JEDEC JS 9703 – IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
Product Details
- Published:
- 03/01/2009
- Number of Pages:
- 46
- File Size:
- 1 file , 3.7 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Category: JEDEC
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