Category
Recently Viewed Products
-
GAMP Good Practice Guide: A Risk-Based Approach to GxP Compliant Laboratory Computerized Systems (Second Edition)
$460.00$276.00 -
CIE x048-PO44
$31.80$19.08 -
ISPE Baseline Guide: Volume 2 - Oral Solid Dosage Forms
$515.00$309.00 -
JEDEC EIA 397
$228.00$136.80 -
GAMP Good Practice Guide: A Risk-Based Approach to Testing of GxP Systems (Second Edition)
$460.00$276.00
JEDEC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC J-STD-048
$51.00$30.60Add to cartNotification Standard for Product Discontinuance
Published by Publication Date Number of Pages JEDEC 11/01/2014 10 -
JEDEC JESD99C
$163.00$97.80Add to cartTerms, Definitions, and Letter Symbols for Microelectronic Devices
Published by Publication Date Number of Pages JEDEC 12/01/2012 120 -
JEDEC J-STD-609B
$62.00$37.20Add to cartMARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY
Published by Publication Date Number of Pages JEDEC 04/01/2016 24 -
JEDEC JS-001-2017
$91.00$54.60Add to cartESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing – Human Body Modal (HBM) – Component Level
Published by Publication Date Number of Pages JEDEC 05/12/2017 0
JEDEC J-STD-033D – Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.5 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC JESD99C
$163.00$97.80Add to cartTerms, Definitions, and Letter Symbols for Microelectronic Devices
Published by Publication Date Number of Pages JEDEC 12/01/2012 120 -
JEDEC JS709C
$60.00$36.00Add to cartJoint JEDEC/ECA Standard: Definition of "Low-Halogen" for Electronic Products
Published by Publication Date Number of Pages JEDEC 03/01/2018 20 -
JEDEC JS 9702
$60.00$36.00Add to cartIPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
Published by Publication Date Number of Pages JEDEC 06/01/2004 19 -
JEDEC JESD96A
$106.00$63.60Add to cartRADIO FRONT END – BASEBAND (RF-BB) INTERFACE
Published by Publication Date Number of Pages JEDEC 02/01/2006 61