Category
Recently Viewed Products
-
ISPE Baseline Guide: Volume 1 - Active Pharmaceutical Ingredients (Second Edition)
$515.00$309.00 -
NAS 979
$67.00$40.20 -
GAMP Good Practice Guide: A Risk-Based Approach to Calibration Management, Second Edition
$460.00$276.00 -
GAMP Good Practice Guide: Data Integrity - Manufacturing Records
$375.00$225.00 -
CIE 054.2
$114.48$68.69
JEDEC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC JESD96A
$106.00$63.60Add to cartRADIO FRONT END – BASEBAND (RF-BB) INTERFACE
Published by Publication Date Number of Pages JEDEC 02/01/2006 61 -
JEDEC JESD99C
$163.00$97.80Add to cartTerms, Definitions, and Letter Symbols for Microelectronic Devices
Published by Publication Date Number of Pages JEDEC 12/01/2012 120 -
JEDEC J-STD-609B
$62.00$37.20Add to cartMARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY
Published by Publication Date Number of Pages JEDEC 04/01/2016 24 -
JEDEC JS 9703
$87.00$52.20Add to cartIPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
Published by Publication Date Number of Pages JEDEC 03/01/2009 46
JEDEC J-STD-033D – Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.5 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC J-STD-609B
$62.00$37.20Add to cartMARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY
Published by Publication Date Number of Pages JEDEC 04/01/2016 24 -
JEDEC JS-001-2017
$91.00$54.60Add to cartESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing – Human Body Modal (HBM) – Component Level
Published by Publication Date Number of Pages JEDEC 05/12/2017 0 -
JEDEC TENTSTD 12
$59.00$35.40Add to cartSTANDARD FOR SELENIUM SURGE SUPPRESSORS
Published by Publication Date Number of Pages JEDEC 11/01/1973 22 -
JEDEC JESD92
$74.00$44.40Add to cartPROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS
Published by Publication Date Number of Pages JEDEC 08/01/2003 32