Category
Recently Viewed Products
-
JEDEC JEP001-3A
$72.00$43.20 -
GAMP Good Practice Guide: A Risk-Based Approach to Testing of GxP Systems (Second Edition)
$460.00$276.00 -
HI 10.6
$90.00$54.00 -
HI 3.1-3.5
$125.00$75.00
JEDEC JEP159A
$74.00 $44.40
PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
Published by | Publication Date | Number of Pages |
JEDEC | 07/01/2015 | 30 |
JEDEC JEP159A – PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
This document is intended for use in the semiconductor IC manufacturing industry and provides reliability characterization techniques for low-k inter/intra level dielectrics (ILD) for the evaluation and control of ILD processes. It describes procedures developed for estimating the general integrity of back-end-of-line (BEOL) ILD. Two basic test procedures are described, the Voltage-Ramp Dielectric Breakdown (VRDB) test, and the Constant Voltage Time-Dependent Dielectric Breakdown stress (CVS). Each test is designed for different reliability and process evaluation purposes. This document also describes robust techniques to detect breakdown and TDDB data analysis.
Product Details
- Published:
- 07/01/2015
- Number of Pages:
- 30
- File Size:
- 1 file , 510 KB
- Redline File Size:
- 2 files , 4.6 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC JS709C
$60.00$36.00Add to cartJoint JEDEC/ECA Standard: Definition of "Low-Halogen" for Electronic Products
Published by Publication Date Number of Pages JEDEC 03/01/2018 20 -
JEDEC JESD9C
$141.00$84.60Add to cartInspection Criteria for Microelectronic Packages and Covers
Published by Publication Date Number of Pages JEDEC 05/01/2017 82 -
JEDEC J-STD-033D
$89.00$53.40Add to cartHandling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
Published by Publication Date Number of Pages JEDEC 04/01/2018 31 -
JEDEC JP001A
$87.00$52.20Add to cartFOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
Published by Publication Date Number of Pages JEDEC 02/01/2014 48