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JEDEC JEP156A – CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.
Product Details
- Published:
- 03/01/2018
- Number of Pages:
- 24
- File Size:
- 1 file , 85 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Category: JEDEC
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