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GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
| Published by | Publication Date | Number of Pages |
| JEDEC | 01/01/2008 | 34 |
JEDEC JEP154 – GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
Product Details
- Published:
- 01/01/2008
- Number of Pages:
- 34
- File Size:
- 1 file , 370 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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