Category
IPC 0040
$148.00 $88.80
Optoelectronics Assembly and Packaging Technology
Published by | Publication Date | Number of Pages |
IPC | 05/01/2003 | 161 |
IPC 0040 – Optoelectronics Assembly and Packaging Technology
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner in which these parts will become an integral part of the functioning module, board or subassembly.
Product Details
- Published:
- 05/01/2003
- Number of Pages:
- 161
- File Size:
- 1 file , 2.5 MB
- Product Code(s):
- 0040(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
IPC WP-008
$93.00$55.80Add to cartSetting Up Ion Chromatography Capability
Published by Publication Date Number of Pages IPC 12/01/2005 16 -
IPC WP-024
$26.00$15.60Add to cartWhite Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market
Published by Publication Date Number of Pages IPC 08/01/2018 20 -
IPC WP-014A
$20.00$12.00Add to cartPb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace and Defense Electronics Industries
Published by Publication Date Number of Pages IPC 04/07/2020 12 -
IPC TR-485
$79.00$47.40Add to cartResults of Copper Foil Rupture Strength Test Round Robin Study
Published by Publication Date Number of Pages IPC 03/01/1985 27