Category
Recently Viewed Products
-
CISPR 12 Ed. 6.0 b
$204.00$122.40 -
ASME Y14.45
$105.00$63.00 -
CLSI C62
$180.00$108.00 -
AS/NZS ISO/IEC 9798.4
$38.38$23.03 -
DIN 10164-2
$51.73$31.04
IPC 0040
$148.00 $88.80
Optoelectronics Assembly and Packaging Technology
Published by | Publication Date | Number of Pages |
IPC | 05/01/2003 | 161 |
IPC 0040 – Optoelectronics Assembly and Packaging Technology
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner in which these parts will become an integral part of the functioning module, board or subassembly.
Product Details
- Published:
- 05/01/2003
- Number of Pages:
- 161
- File Size:
- 1 file , 2.5 MB
- Product Code(s):
- 0040(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
IPC WP-024
$26.00$15.60Add to cartWhite Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market
Published by Publication Date Number of Pages IPC 08/01/2018 20 -
IPC TR-486
$131.00$78.60Add to cartReport on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Published by Publication Date Number of Pages IPC 07/01/2001 56 -
IPC TR-485
$79.00$47.40Add to cartResults of Copper Foil Rupture Strength Test Round Robin Study
Published by Publication Date Number of Pages IPC 03/01/1985 27 -
IPC WP-019B
$158.00$94.80Add to cartWhite Paper on Global Change in Ionic Cleanliness Requirements
Published by Publication Date Number of Pages IPC 09/01/2020 28