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Category: IPC
Showing 226–240 of 332 results
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IPC J-STD-005A
$93.00$55.80Add to cartRequirements for Soldering Pastes
Published by Publication Date Number of Pages IPC 02/01/2012 24 -
IPC J-STD-006B
$79.00$47.40Add to cartRequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by Publication Date Number of Pages IPC 01/01/2006 30 -
IPC J-STD-006C
$93.00$55.80Add to cartRequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by Publication Date Number of Pages IPC 07/01/2013 36 -
IPC J-STD-012
$168.00$100.80Add to cartImplementation of Flip Chip and Chip Scale Technology
Published by Publication Date Number of Pages IPC 01/01/1996 105 -
IPC J-STD-013
$131.00$78.60Add to cartImplementation of Ball Grid Array and Other High Density Technology
Published by Publication Date Number of Pages IPC 08/01/1996 123 -
IPC J-STD-020E
$83.00$49.80Add to cartMoisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Published by Publication Date Number of Pages IPC 01/01/2015 24 -
IPC J-STD-026
$113.00$67.80Add to cartSemiconductor Design Standard for Flip Chip Applications
Published by Publication Date Number of Pages IPC 04/01/1999 48 -
IPC J-STD-027
$93.00$55.80Add to cartMechanical Outline Standard for Flip Chip or Chip Scale Configurations
Published by Publication Date Number of Pages IPC 02/01/2003 20 -
IPC J-STD-028
$113.00$67.80Add to cartPerformance Standard fo Construction of Flip Chip and Chip Scale Bumps
Published by Publication Date Number of Pages IPC 04/01/1999 36 -
IPC J-STD-030A
$168.00$100.80Add to cartSelection and Application of Board Level Underfill Materials
Published by Publication Date Number of Pages IPC 02/01/2014 48 -
IPC J-STD-032
$79.00$47.40Add to cartPerformance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
Published by Publication Date Number of Pages IPC 06/01/2002 10 -
IPC J-STD-033D
$93.00$55.80Add to cartHandling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Published by Publication Date Number of Pages IPC 03/01/2018 32 -
IPC J-STD-035
$79.00$47.40Add to cartAcoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
Published by Publication Date Number of Pages IPC 04/01/1999 20 -
IPC J-STD-046
$93.00$55.80Add to cartCustomer Notification Standard for Product/Process Changes by Electronic Product Suppliers
Published by Publication Date Number of Pages IPC 07/01/2016 14 -
IPC J-STD-075
$93.00$55.80Add to cartClassification of Non-IC Electronic Components for Assembly Processes
Published by Publication Date Number of Pages IPC 08/01/2008 20