Category: IPC

Showing 301–315 of 332 results

  • IPC TR-465-2

    $67.80

    The Effect of Steam Aging Time and Temperature on Solderability Test Results

    Published by Publication Date Number of Pages
    IPC 01/01/1993 51
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  • IPC TR-465-3

    $55.80

    Evaluation of Steam Aging on Alternative Finishes, Phase 11A

    Published by Publication Date Number of Pages
    IPC 07/01/1996 17
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  • IPC TR-466

    $47.40

    Technical Report: Wetting Balance Standard Weight Comparison Test

    Published by Publication Date Number of Pages
    IPC 04/01/1995 16
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  • IPC TR-467

    $55.80

    Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)

    Published by Publication Date Number of Pages
    IPC 11/01/1996 12
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  • IPC TR-468

    $47.40

    Factors Affecting Insulation Resistance Performance of Printed Boards

    Published by Publication Date Number of Pages
    IPC 03/01/1979 28
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  • IPC TR-470

    $47.40

    Thermal Characteristics of Multilayer Interconnection Boards

    Published by Publication Date Number of Pages
    IPC 01/01/1974 20
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  • IPC TR-474

    $47.40

    An Overview of Discrete Wiring Techniques

    Published by Publication Date Number of Pages
    IPC 03/01/1979 40
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  • IPC TR-481

    $67.80

    Results of Multilayer Test Program Round Robin

    Published by Publication Date Number of Pages
    IPC 04/01/1981 86
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  • IPC TR-483

    $67.80

    Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II

    Published by Publication Date Number of Pages
    IPC 03/01/1991 74
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  • IPC TR-484

    $47.40

    Results of IPC Copper Foil Ductility Round Robin Study

    Published by Publication Date Number of Pages
    IPC 04/01/1986 23
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  • IPC TR-485

    $47.40

    Results of Copper Foil Rupture Strength Test Round Robin Study

    Published by Publication Date Number of Pages
    IPC 03/01/1985 27
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  • IPC TR-486

    $78.60

    Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

    Published by Publication Date Number of Pages
    IPC 07/01/2001 56
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  • IPC TR-551

    $88.80

    Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

    Published by Publication Date Number of Pages
    IPC 07/01/1993 104
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  • IPC TR-579

    $78.60

    Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

    Published by Publication Date Number of Pages
    IPC 09/01/1988 80
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  • IPC TR-580

    $67.80

    Cleaning and Cleanliness Test Program Phase 1 Test Results

    Published by Publication Date Number of Pages
    IPC 10/01/1989 110
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