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SAE AIR1141
$62.40
1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits
standard by SAE International, 12/01/1971
SAE AIR1141 – 1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits
Product Details
- Published:
- 12/01/1971
- File Size:
- 1 file , 640 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
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