Description

MIL MIL-STD-202/219 – METHOD 219, SHEAR STRESS

The purpose of this test is to determine the integrity of materials and procedures used to attach surface mounted chip components to package headers or other substrates. This determination is based on a measure of force applied to the chip components, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.

Product Details

Published:

09/11/2017

Number of Pages:

6

File Size:

1 file , 89 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus