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IPC SMC-TR-001

IPC SMC-TR-001

$45.60

An Introduction to Tape Automated Bonding Fine Pitch Technology

Published by Publication Date Number of Pages
IPC 01/01/1989 54
Digital PDFMulti-User AccessPrintable

IPC SMC-TR-001 – An Introduction to Tape Automated Bonding Fine Pitch Technology

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

Product Details

Published:
01/01/1989
Number of Pages:
54
File Size:
1 file , 1.4 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
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