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IPC 4104
$131.00 $78.60
Specifications for High Density Interconnect (HDI) and Microvia Materials
Published by | Publication Date | Number of Pages |
IPC | 05/01/1999 | 100 |
IPC 4104 – Specifications for High Density Interconnect (HDI) and Microvia Materials
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.
Product Details
- Published:
- 05/01/1999
- ANSI:
- ANSI Approved
- Number of Pages:
- 100
- File Size:
- 1 file , 440 KB
- Product Code(s):
- 4104(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Category: IPC
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