Description
JIS C 60068-2-58 – Environmental testing — Part 2: Tests — Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Product Details
- Published:
- 01/01/2002
- File Size:
- 1 file , 1.7 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus