Category
Recently Viewed Products
-
NAS 1021
$69.00$41.40 -
LIA Z136.1
$203.00$121.80 -
ASTM G87
$48.00$28.80 -
JEDEC JESD8C.01
$56.00$33.60 -
JEDEC JEP120-A
$141.00$84.60
JEDEC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC J-STD-035
$35.00$21.00Add to cartJOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
Published by Publication Date Number of Pages JEDEC 05/01/1999 0 -
JEDEC JESD94B
$80.00$48.00Add to cartAPPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY
Published by Publication Date Number of Pages JEDEC 10/01/2015 47 -
JEDEC J-STD-020E
$75.00$45.00Add to cartJOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES
Published by Publication Date Number of Pages JEDEC 12/01/2014 24 -
JEDEC JS 9702
$60.00$36.00Add to cartIPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
Published by Publication Date Number of Pages JEDEC 06/01/2004 19
JEDEC J-STD-033D – Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
Product Details
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.5 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Related products
-
JEDEC JS 9704
$74.00$44.40Add to cartIPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
Published by Publication Date Number of Pages JEDEC 06/01/2005 32 -
JEDEC TENTSTD 12
$59.00$35.40Add to cartSTANDARD FOR SELENIUM SURGE SUPPRESSORS
Published by Publication Date Number of Pages JEDEC 11/01/1973 22 -
JEDEC JESD91B
$60.00$36.00Add to cartMethod for Developing Acceleration Models for Electronic Device Failure Mechanisms
Published by Publication Date Number of Pages JEDEC 03/01/2022 20 -
JEDEC JP 002
$72.00$43.20Add to cartCURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
Published by Publication Date Number of Pages JEDEC 03/01/2006 29